INSPEC has developed and supplied several inspection equipment in the field of inspection of semiconductor packages such as lead frame to COF for liquid crystals, and furthermore CSP and FC. Advanced inspection technologies built with this proven track record has been extensively used in development PCB substrate AOI series that can even support the next generation of devices equipped with image systems based on completely new concepts.
We are confident of meeting the expectation of continuously advancing board manufacturers.
- ・High sensitivity and high-speed processing
- ・With our indigenous lighting configuration, we can handle various degree of brilliance of representation
- ・High precision inspection by the sub-pixel measurement processing algorithm by gray image
- ・SX5400/SX5300 are equipped with focus control as the standard feature
- ・It can measure and determine all patterns (wire width, space) (※Figure on right)
Click the image to enlarge it
- ・We can offer from ultra-fine pattern (L/S 5/5μｍ) up to regular package board.
- ・Images of the defects are shown in the inspection results