INSPEC has developed and supplied several inspection equipment in the field of inspection of semiconductor packages such as lead frame to COF for liquid crystals, and furthermore CSP and FC. Advanced inspection technologies built with this proven track record has been extensively used in development PCB substrate AOI series that can even support the next generation of devices equipped with image systems based on completely new concepts.
We are confident of meeting the expectation of continuously advancing board manufacturers.
- ・Can be proposed in automatic transfer system in the frame state and even the piece state
- ・Independent inspection for each part under multiple lighting conditions.
Changeover of up to 3 types is possible (※figure on right) Click the image to enlarge it
- ・We can propose most suitable inspection processing for gray processing/color processing